application
Semiconductor: Dicing of various types of package（BGA/QFN/DFN）, wafer sawing and grinding.
Optoelectronic: Slotting, dicing and pickling of coated glass and ordinary glass.
Others: Process in which work piece should be covered when machining and uncovered after that without adhesive residue.
Property
| Property | |||||
| Product Code Technical Parameters | P4640 | P4611 | P4662 | P4616 | P4618 |
| Color | Translucence | Translucence | Translucence | Translucence | Translucence |
| Total Thickness[mm] | 0.08 | 0.11 | 0.155 | 0.16 | 0.16 |
| Backing Thickness[mm] | 0.05 | 0.1 | 0.14 | 0.14 | 0.14 |
| Backing | PET | PET | PO | PO | PO |
| Adhesive | Acrylic | Acrylic | Acrylic | Acrylic | Acrylic |
| 180°Peel Strength （Before UV ）[N/inch] | 20 | 8 | 12 | 10 | 20 |
| 180°Peel Strength （After UV ）[N/inch] | 0.05～0.1 | 0.03～0.06 | 0.15～0.25 | 0.3～0.5 | 0.05～0.1 |
| UV Exposure Rate[mJ/cm2] | 300～500mJ | 300～500mJ | 300～500mJ | 300～500mJ | 300～500mJ |
| Application | Glass | Glass | MEMS CHIPS | Ceramics | wafer |
